Today’s advanced devices require advanced solutions. Multi-Chip Package (MCP) solutions from Numonyx deliver customers the valuable space savings needed to meet design requirements. Our broad range of MCP offerings combine world-class Numonyx flash memory with flexible RAM options, with the quality and reliability you expect from a leader–all in one package.
Designed with a wide range of non-volatile memory and RAM product combinations, the Numonyx portfolio of MCP solutions offers fast time-to-market and flexibility to meet your application design requirements. Whether your application is for wireless, embedded or data storage applications, you can trust that Numonyx has the right combination of memory features.
Building Blocks for MCPs
World-class silicon: Numonyx MCPs feature StrataFlash® NOR memory and a wide range of hihg-density Numonyx NAND to deliver precisely the solution you need. If you require NOR and NAND together, we can deliver. One or the other alone combined with high-quality RAM, absolutely! Our goal is to meet your needs with a world-class multi-chip solution.
RAM supply: In-house development and 12-inch foundry partners ensure that Numonyx RAM solutions deliver lower costs and higher capacity for a range of needs. Design-in our low power (LP) RAM with your choice of non-volatile memory–NOR or NAND–or choose from our offerings of NVM + LP PSRAM, LP SDR DRAM, and LP DDR DRAM combinations.
Leadership in packaging technologies: We’ve shipped over 100 million MCPs in high volume production since 1996. Our experience has driven common packages and footprints that enable designs to easily upgrade to higher densities, performance and functionality as application needs evolve. Advanced MCPs allow up to 5 stacked die and package heights as low as 0.80 mm. Plus, advanced wafer thinning and package technologies allow greater flexibility in stacking various silicon technologies to provide even lower profile package heights.
Manufacturing excellence: From providing thin-layer die to offering the latest in bonding techniques, the manufacturing of Numonyx MCPs is state-of-the-art. A range of electrical ballouts–including x8, x16, and x32, shared-bus and multi-bus width options–can match your mixed-memory technology needs for MCPs.
Product Combinations
