| Organization |
x16 |
|
|
|
X |
|
| x8 |
X |
X |
X |
|
X |
| Low Density |
128 Mb |
X |
|
|
|
|
| 256 Mb |
X |
|
|
|
|
| 512 Mb |
X |
|
|
|
|
| High Density |
1 Gb |
x |
X |
|
X |
|
| 2 Gb |
|
X |
|
|
|
| 4 Gb |
|
X |
|
|
|
| 8 Gb |
|
X |
X |
|
|
| |
16Gb |
|
X |
X |
|
|
| Very High Density |
1 GB |
|
|
|
|
X |
| 2 GB |
|
|
|
|
X |
| 4 GB |
|
|
|
|
X |
| 8 GB |
|
|
|
|
X |
| Performance |
Cache Program and Read operation |
|
X |
|
|
|
| Multiplane operation |
|
X |
X |
|
|
| Supply Voltage Vdd |
1.8V |
X |
X |
|
X |
|
| 3V |
X |
X |
X |
|
|
| 1.8V/ 3.3V |
|
|
|
|
X |
| Interface |
NOR |
|
|
|
X |
|
| NAND |
X |
X |
X |
|
|
| Multiplexed address/data |
X |
X |
X |
X |
|
| MMC |
|
|
|
|
X |
| Security |
One Block OTP area |
|
|
|
X |
|
| One Page OTP area |
X |
X |
X |
|
|
| Unique ID Code |
X |
X |
X |
|
|
| Package and Ballout |
TFBGA/LFBGA Stacked-CSP |
X |
X |
|
X |
|
| PoP |
X |
X |
|
|
|
| FBGA63 10 x 13mm, 1mm |
|
|
|
X |
|
| TSOP48 12 x 20mm |
X |
X |
X |
|
|
| VFBGA55 8 x 10 x 1mm |
X |
X |
X |
|
|
| VFBGA63 9 x 11 x 1mm |
X |
X |
|
|
|
| VFBGA63 9.5 x 12 mm |
|
X |
|
|
|
| LGA52 12 x 17 mm |
|
X |
X |
|
|
| LFBGA (JEDEC std) |
|
|
|
|
X |
| Wafer |
X |
X |
X |
|
|
| Software |
SCFS |
X |
X |
X |
|
X |
| NFTL |
X |
X |
X |
|
|
| Low Level Drivers |
X |
X |
X |
|
|
*OneNAND™ is a registered trademark of Samsung Electronics, Co, Ltd