BGA Packages
For space constrained applications, Ball Grid Array/Land Grid Array packages provide a small XY-size chip-scale memory footprint. Our careful attention to the interaction between packaging and NOR, NAND, PCM and RAM die performance, along with standardized electrical footprints, can meet your requirements for quick time-to-market and product flexibility. Switching memory types and changing memory density can be implemented without a change to your PCB design.

Package-on-Package (PoP)
For the ultimate in small XY size, package-on-package is the right solution. With the memory mounted above the existing logic package, or above another existing memory package, Numonyx memory solutions can be integrated with little-to-no consumption of valuable PCB space. The result? You have the ability to deliver a more compact product or use the saved space to provide more functionality. Additionally, the direct connections between memory and logic improve frequency performance, simplify your PCB design and enable increased functionality for smaller devices.

Leadframe Packages
When size constraints allow, a larger pitched leadframe-based solution can provide the simplest Surface Mount Technology integration. With the technological maturity and reliability of leadframe packaging, these solutions are often the best choice for lower die count, lower I/O count, less space-constrained or lower-cost applications.

Removable Cards
For high density, removable media in industry-standard form factors, memory cards are the best choice. Core technologies proven in high die count, multi-chip BGA and PoP packages are also used in cards to enable high density solutions.

Pb Free/Halogen Free
Numonyx is fully committed to minimizing lead-based and halogen-based materials in our memory solutions. Lead Free (Pb Free) and Halogen Free packages are our standard offerings, and we have reduced or eliminated the usage of restricted and hazardous substances in compliance with RoHS and other regulations.