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GBR:
Raw Card A
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12/2009
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386.51 KB
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Other Documents
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BRD File:
Raw Card A
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12/2009
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348.91 KB
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Other Documents
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MFG Package Info:
Raw Card A
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12/2009
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483.55 KB
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Other Documents
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GBR:
Raw Card B
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12/2009
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168.8 KB
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Other Documents
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MFG Package Info:
Raw Card B
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12/2009
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476.1 KB
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Other Documents
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GBR:
Raw Card C
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12/2009
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144.39 KB
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Other Documents
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BRD File:
Raw Card A
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12/2009
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492.09 KB
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Other Documents
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MFG Package Info:
Raw Card C
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12/2009
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303.39 KB
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Other Documents
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BRD File:
Raw Card C
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12/2009
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389.19 KB
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Other Documents
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Thermal Applications:
Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature
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TN-00-08
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05/2010
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252.18 KB
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Technical Note
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Recommended Soldering Parameters:
Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products.
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TN-00-15
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03/2007
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69.09 KB
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Technical Note
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Uprating of Semiconductors for High-Temperature Applications:
Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications
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TN-00-18
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05/2010
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428.33 KB
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Technical Note
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Understanding Signal Integrity:
Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
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TN-00-20
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12/2009
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1.52 MB
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Technical Note
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Memory Module Serial Presence-Detect:
Describes how SPD is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules
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TN-04-42
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12/2009
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505.83 KB
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Technical Note
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Comparing Module Parameters:
Compares module parameters.
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TN-04-49
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03/2003
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52.71 KB
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Technical Note
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High-Speed DRAM Controller Design:
Identifies and discusses five key areas of DRAM controller design
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TN-04-54
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04/2008
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1 MB
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Technical Note
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DRAM Module Form Factors:
Compares the most common DRAM module form factors
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TN-04-55
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09/2009
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435.56 KB
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Technical Note
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Module Part Numbering Systems:
Part numbering guides for Micron DDR3, DDR, DDR, and SDRAM modules.
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02/2012
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41.77 KB
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Part Numbering Guide
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PCN/EOL Systems:
Explains Micron's product change notification and end-of-life systems.
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CSN-12
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08/2009
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75.58 KB
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Customer Service Note
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Wafer Packaging and Packaging Materials:
Provides complete shipping and recycling information about each of the materials used for shipping Micron's products.
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CSN-20
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09/2011
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776.24 KB
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Customer Service Note
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Bare Die SiPs and MCMs:
Describes design considerations for bare die SiPs and MCMs.
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CSN-18
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04/2009
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151.06 KB
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Customer Service Note
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Shipping Quantities:
Provides tables of part quantity.
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CSN-04
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10/2011
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463.55 KB
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Customer Service Note
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Micron Component and Module Packaging:
Explanation of Micron packaging labels and procedures.
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CSN-16
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02/2012
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840.61 KB
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Customer Service Note
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ESD Precautions for Die/Wafer Handling and Assembly:
Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
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CSN-24
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08/2010
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119.08 KB
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Customer Service Note
|
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Electronic Data Interchange:
Describes EDI transmission sets, protocol, and contacts.
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CSN-06
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09/2005
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53.5 KB
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Customer Service Note
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RMA Procedures for Packaged Product and Bare Die Devices:
Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
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CSN-07
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10/2010
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82.64 KB
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Customer Service Note
|
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ISO System Management Standards:
Describes ISO system management standards.
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CSN-08
|
04/2004
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39.18 KB
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Customer Service Note
|
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Competitive DDR Memory Subsystems:
DDR milestones and platform design
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|
12/2009
|
2.64 MB
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Presentation
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DDR System Design Considerations:
DDR overview
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|
12/2009
|
3.46 MB
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Presentation
|
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The Future of Memory and Storage:
Overview of trends for main memory and Flash memory
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12/2009
|
1.54 MB
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Presentation
|
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Design Guide for Two DDR3-1066 UDIMM Systems:
Rev. B, Design guide to assist board designers implementing products using UDIMM systems
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TN-41-08
|
01/2010
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1.1 MB
|
Technical Note
|
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Moisture Absorption in Plastic Packages:
Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
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TN-00-01
|
02/2010
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87.26 KB
|
Technical Note
|
|
|
Accelerate Design Cycles with Simulation Models:
Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design.
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TN-00-09
|
02/2010
|
206.91 KB
|
Technical Note
|
|
|
Micron Wire-Bonding Techniques:
This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products.
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TN-00-22
|
11/2010
|
66.13 KB
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Technical Note
|
|
|
Micron BGA Manufacturer's User Guide:
Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
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CSN-33
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07/2011
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353.32 KB
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Customer Service Note
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Proper Handling Procedures for Micron DIMMs:
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|
12/2009
|
396.18 KB
|
Module Handling Guide
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Proper Installation Procedures for Micron DIMMs:
|
|
12/2009
|
419.89 KB
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Module Handling Guide
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Proper Installation Procedures for Micron SODIMMs:
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|
12/2009
|
419.6 KB
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Module Handling Guide
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Proper Handling of Micron DIMMs - Japanese:
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|
12/2009
|
453.96 KB
|
Module Handling Guide
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Proper Installation of Micron DIMMs - Japanese:
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|
12/2009
|
394.2 KB
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Module Handling Guide
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Proper Installation of Micron SODIMMs - Japanese:
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|
12/2009
|
483.52 KB
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Module Handling Guide
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Proper Installation of Micron DIMMs - Simplified Chinese:
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|
12/2009
|
592.58 KB
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Module Handling Guide
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Proper Installation of Micron SODIMMs - Simplified Chinese:
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|
12/2009
|
604.38 KB
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Module Handling Guide
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Proper Handling of Micron DIMMs - Spanish:
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|
12/2009
|
461.82 KB
|
Module Handling Guide
|
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Proper Installation of Micron DIMMs - Spanish:
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|
12/2009
|
546.81 KB
|
Module Handling Guide
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Proper Installation of Micron SODIMMs - Spanish:
|
|
12/2009
|
542.23 KB
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Module Handling Guide
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Proper Handling of Micron DIMMs - Traditional Chinese:
|
|
12/2009
|
539.92 KB
|
Module Handling Guide
|
|
|
Proper Installation of Micron DIMMs - Traditional Chinese:
|
|
12/2009
|
758.93 KB
|
Module Handling Guide
|
|
|
Proper Installation of Micron SODIMMs – Traditional Chinese:
|
|
12/2009
|
775.63 KB
|
Module Handling Guide
|
|
|
DDR Unbuffered SODIMM Design Standard:
PC2700 Rev 1.0
|
|
12/2009
|
148.01 KB
|
Other Documents
|
|
|
Product Marks/Product and Packaging Labels:
Explains product part marking, and product and packaging labels.
|
CSN-11
|
02/2012
|
666.83 KB
|
Customer Service Note
|
|
|
Bypass Capacitor Selection for High-Speed Designs:
Describes bypass capacitor selection for high-speed designs.
|
TN-00-06
|
03/2011
|
481.9 KB
|
Technical Note
|