Parallel PCM

parallel pcm

Parallel PCM for Performance and Endurance

Our P8P phase change memory (PCM) combines the best traits of traditional memory technologies into a single, nonvolatile device with a performance-boosting parallel interface. Ideal for high-end high performance embedded applications, second-generation P8P products increase performance, improve endurance, and simplify software management.

circuit boardFuture-Proofing With Parallel

Is there a single memory technology that can fit all your embedded platforms, with the fast parallel interface that your app demands? Yes!

Now in its second generation, this device is designed specifically for performance-intensive embedded applications, combining the benefits of phase change memory with the compatibility of a NOR-like parallel interface. P8P improves overall performance and enables software simplification using byte-alterability (overwrite capability). It also increases system-level reliability by delivering 1 million write-cycle endurance (compared to 100,000 for NOR flash).

Parallel PCM Part Catalog and Documentation

Serial PCM Design Resources

Great design resources are available to help you get the most out of your PCM solution.

Why Buy PCM from Micron?

PCM products are backed by 30 years of Micron’s industry-leading expertise and innovation in semiconductor design and manufacturing. You’ll get the stability, flexibility, support, and availability that you need in a long-term memory solution and in a long-term memory provider—the Micron quality and capability you’ve come to expect!

And not only do we have the solutions you need, we’ll help you make the best use of the technology, from comprehensive data sheets to time-saving simulation models. Dive into our technical resources on a do-it-yourself design or work with a local field applications engineer if your mass-market project presents a unique challenge. Whatever you need to get your design to market faster, easier, and better—we want to deliver it.

Features Benefits
Density: 128Mb (90nm lithography) Advanced technology for a broad range of embedded applications
Byte-alterable Improves system performance by not having to perform erase operations
Endurance: 1,000,000 cycles Reduces system and software management. Ideal for write intensive applications
Interface: High performance parallel interface Command set and hardware compatible with today’s parallel NOR solutions
Voltage range: 2.7 – 3.6V VCC; 1.7 – 3.6V VCCQ Ideal for a wide variety of traditional embedded applications
Packages: 56-lead TSOP; 64-ball Easy BGA (8x10mm) Fits into existing parallel NOR sockets
Temperature range: -40ºC to +85ºC & 0ºC to +70ºC Supports industrial and commercial temperature for a wide variety of embedded applications

White Paper: PCM and Memory Usage Models

Learn how PCM meets the needs of growing application requirements with our white paper, Phase Change Memory (PCM): A new memory technology to enable new memory usage models. The paper discusses scalability and examines PCM in computing, embedded, and wireless systems.

Download White Paper

Type Secure Title & Description ID# Updated Size
PCN/EOL Systems:  Explains Micron's product change notification and end-of-life systems. CSN-12 08/2009 75.58 KB
Wafer Packaging and Packaging Materials:  Provides complete shipping and recycling information about each of the materials used for shipping Micron's products. CSN-20 09/2011 776.24 KB
Bare Die SiPs and MCMs:  Describes design considerations for bare die SiPs and MCMs. CSN-18 04/2009 151.06 KB
Shipping Quantities:  Provides tables of part quantity. CSN-04 10/2011 463.55 KB
Micron Component and Module Packaging:  Explanation of Micron packaging labels and procedures. CSN-16 02/2012 840.61 KB
ESD Precautions for Die/Wafer Handling and Assembly:  Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. CSN-24 08/2010 119.08 KB
Electronic Data Interchange:  Describes EDI transmission sets, protocol, and contacts. CSN-06 09/2005 53.5 KB
RMA Procedures for Packaged Product and Bare Die Devices:  Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs. CSN-07 10/2010 82.64 KB
ISO System Management Standards:  Describes ISO system management standards. CSN-08 04/2004 39.18 KB
Accelerate Design Cycles with Simulation Models:  Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design. TN-00-09 02/2010 206.91 KB
The Evolution of Phase Change Memory:  Describes how PCM has evolved and is the next generation of nonvolatile memory. White Paper 03/2011 591.74 KB
Comparing P8P Parallel PCM and Parallel NOR Flash Memory:  Comparing the features of the 128Mb P8P parallel PCM and parallel NOR Flash memory devices enables users to migrate applications from NOR Flash to P8P parallel PCM. AN310053 11/2011 229.34 KB
Micron PCM Innovates System Designs for Smart Grid Products:  A Micron/Singhang case study highlighting the memory system design challenges Singhang had with their smart grid product and how they worked with Micron to implement a superior, single-chip memory solution. Case Study 05/2011 1.17 MB
Industrial and Multi-Market Applications Flyer:  Our extensive and stable portfolio of IMM-focused memory solutions empower technology developments in automotive, industrial, medical, manufacturing, and other multi-market segments. Product Flyer 08/2011 593.95 KB
PCM: A New Memory Technology to Enable New Memory Usage Models:  Describes how PCM blends together the best attributes of NOR Flash, NAND Flash, EEPROM, and RAM to deliver a new category of memory for new usage models White Paper 06/2011 297.2 KB
Micron BGA Manufacturer's User Guide:  Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. CSN-33 07/2011 353.32 KB
Product Marks/Product and Packaging Labels:  Explains product part marking, and product and packaging labels. CSN-11 02/2012 666.83 KB
Flash Data Integrator (FDI) File System Flyer:  Running on Micron's latest NOR Flash and phase change memory (PCM), our Flash Data Integrator (FDI) file system provides dependable storage to create a compelling, low-cost solution. In addition, FDI delivers a true eXecute-in-Place (XiP) advantage in an open architecture to manage code and data in NOR and PCM memory devices. Product Flyer 09/2011 673.02 KB
Compatibility Guide for Micron Software Device Drivers Available on micron.com:  This document lists the compatible NOR, NAND, and PCM devices for the software device drivers available for download from micron.com. Product Flyer 02/2012 227.69 KB
Micron Phase Change Memory for Embedded Applications:  PCM is revolutionary memory that merges the best attributes of NOR, NAND, and RAM, offering unprecedented capability in a single, nonvolatile memory chip. Product Flyer 01/2012 2.19 MB
Software Device Drivers for the Micron P8P Parallel PCM Device:  This technical note describes C library source code for the Micron P8P phase change memory (PCM) device using the P8P software device driver. TN-13-06 03/2011 238.6 KB
Extending PCM Temperature and Data Retention Ranges: Software Refresh Procedure:  This technical note describes a software procedure for refreshing data in Micron® P5Q serial phase change memory (PCM) and P8P parallel PCM devices to enable usage beyond current data sheet specifications. TN-13-07 06/2011 540.15 KB
Extending 90nm PCM Endurance from 1 Million WRITE Cycles Up to 1 Billion Cycles:  This technical note outlines a software solution called the parameter manager, which is used to increase the WRITE cycles for Micron's phase change memory (PCM) well beyond its standard endurance specifications. TN-13-09 11/2011 441.71 KB

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Parallel PCM

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