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Thermal Applications:
Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature
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TN-00-08
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05/2010
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252.18 KB
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Technical Note
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SSD Part Numbering System:
Part numbering guide for Micron SSD products.
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02/2012
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25.62 KB
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Part Numbering Guide
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History of Digital Storage:
This paper surveys the memory storage landscape of the past 50 years starting at the beginning of digital storage and paying homage to IBM™'s groundbreaking RAMAC disk storage unit and StorageTek™'s DRAM-based SSD; then enumerating the benefits of modern NAND Flash memory and advanced SSDs; and finally looking forward to the near-future possibilities of nonvolatile storage.
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White Paper
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12/2009
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739.09 KB
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White Paper
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Embedded Memory Simplifies High-Capacity Storage:
This paper surveys the memory storage landscape of the past 50 years starting at the beginning of digital storage and paying homage to IBM™'s groundbreaking RAMAC disk storage unit and StorageTek™'s DRAM-based SSD; then enumerating the benefits of modern NAND Flash memory and advanced SSDs; and finally looking forward to the near-future possibilities of nonvolatile storage.
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White Paper
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12/2009
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212.64 KB
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White Paper
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PCN/EOL Systems:
Explains Micron's product change notification and end-of-life systems.
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CSN-12
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04/2012
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79.21 KB
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Customer Service Note
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Wafer Packaging and Packaging Materials:
Provides complete shipping and recycling information about each of the materials used for shipping Micron's products.
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CSN-20
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09/2011
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776.24 KB
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Customer Service Note
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Bare Die SiPs and MCMs:
Describes design considerations for bare die SiPs and MCMs.
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CSN-18
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04/2009
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151.06 KB
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Customer Service Note
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Shipping Quantities:
Provides tables of part quantity.
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CSN-04
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04/2012
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472.27 KB
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Customer Service Note
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Micron KGD Definitions:
Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die.
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CSN-22
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07/2009
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65.52 KB
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Customer Service Note
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Micron Component and Module Packaging:
Explanation of Micron packaging labels and procedures.
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CSN-16
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02/2012
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887.13 KB
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Customer Service Note
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ESD Precautions for Die/Wafer Handling and Assembly:
Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
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CSN-24
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08/2010
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119.08 KB
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Customer Service Note
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Electronic Data Interchange:
Describes EDI transmission sets, protocol, and contacts.
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CSN-06
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09/2005
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53.5 KB
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Customer Service Note
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RMA Procedures for Packaged Product and Bare Die Devices:
Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
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CSN-07
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10/2010
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82.64 KB
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Customer Service Note
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ISO System Management Standards:
Describes ISO system management standards.
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CSN-08
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04/2004
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39.18 KB
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Customer Service Note
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SSDs: A Shift in Data Storage:
Overview of advantages, products for different markets, reliability
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12/2009
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1.21 MB
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Presentation
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Moisture Absorption in Plastic Packages:
Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
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TN-00-01
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02/2010
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87.26 KB
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Technical Note
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The SMART Command Feature Set:
TN-FD-03: The SMART Command Feature Set
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TN-FD-03
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09/2010
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485.87 KB
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Technical Note
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RealSSD Embedded USB Reliability Status Reporting:
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TN-FD-02
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11/2010
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67.48 KB
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Technical Note
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Putting SSDs to the Test:
A recap of how Micron and Flexstar came to work together to develop and improve their own SSDs and SSD test platforms, respectively, and at the same time help move the industry forward with more reliable benchmarking.
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Case Study
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12/2009
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458.88 KB
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Case Study
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Micron BGA Manufacturer's User Guide:
Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
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CSN-33
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07/2011
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353.32 KB
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Customer Service Note
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Product Marks/Product and Packaging Labels:
Explains product part marking, and product and packaging labels.
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CSN-11
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04/2012
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724.89 KB
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Customer Service Note
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e230 Firmware Update Software for Linux OS:
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TN-FD-09
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01/2012
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123.19 KB
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Software
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e230 Firmware Update Software for Windows OS:
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TN-FD-08
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02/2012
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242.85 KB
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Software
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Embedded USB Flyer:
Describes the advantages of designing in Micron's rugged, reliable, cost-effective embedded USBs.
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03/2010
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191.8 KB
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Product Flyer
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C400 mSATA NAND Flash SSD:
C400 mSATA NAND Flash SSD
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Rev. C
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04/2012
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333.24 KB
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Data Sheet
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C400v mSATA NAND Flash SSD:
C400v mSATA NAND Flash SSD
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Rev. D
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04/2012
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335.25 KB
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Data Sheet
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Media Management in Solid State Drives: Multistep WRITE Operations:
SSDs write data differently than conventional rotating hard drives (HDDs)—in a multistep process versus a single-step process. This brief examines the multistep write process for SSDs.
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Technical Marketing Brief
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04/2012
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823.8 KB
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Technical Marketing Brief
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An Overview of SSD Write Caching:
This brief provides an overview of the differences in SSD behavior when write cache is enabled versus disabled.
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Technical Marketing Brief
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05/2012
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519.28 KB
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Technical Marketing Brief
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TN-FD-07: Checking the e230 eUSB Bad Block Count:
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TN-FD-07
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01/2012
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108.53 KB
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Technical Note
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TN-FD-08: e230 Firmware Update Instructions for Windows OS:
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TN-FD-08
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01/2012
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129.09 KB
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Technical Note
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TN-FD-09: e230 Firmware Update Instructions for Linux OS:
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TN-FD-09
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01/2012
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137.8 KB
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Technical Note
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